Возраст домена | 24 года |
Дата окончания | Истек срок регистрации |
PR | 4 |
ИКС | n/a |
Страниц в Google | 141 |
Страниц в Яндексе | 136 |
Dmoz | Нет |
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Alexa Traffic Rank | 6070602 |
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История изменения показателей | Авторизация |
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Manufacturer of die bonders and rework systems
die bonder, rework station, advanced packaging equipment
High accuracy, modular die bonders for flip chip, assembly, packaging, and die attach. Advanced rework stations for BGAs, small passives, QFNs, package on package, and reballing.
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Внешние ссылки главной страницы ( 13 ) | |
finetechusa.com/ | Home |
finetech.de/ | Deutsch |
eu.finetech.de/ | English |
finetech-china.com/ | 中国的 |
ru.finetech.de/ | Русский |
finetech-nippon.co.jp/ | 日本の |
eu.finetech.de/micro-assembly/products/fineplacerr-pico-ma/f... | Customized Bonders Based on FINEPLACER® platforms, Finetech develops highly customized equipment solutions according to specific... |
eu.finetech.de/advanced-rework/applications/micro-led-rework... | <img> |
finetechusa.com/company/information/press/detail-view/finete... | learn more |
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twitter.com/fineplacer | |
youtube.com/fineplacer | YouTube |
linkedin.com/company/finetech | |
Внутренние ссылки главной страницы ( 128 ) | |
home.html | <img> |
products.html | Products |
bonders/products/bonders.html | Bonders |
rework/products/rework.html | Rework |
markets/industries-served.html | Industries Served |
contacts.html | Contacts |
company.html | Company |
products/micro-assembly.html | Micro Assembly |
products/micro-assembly/finext-6003.html | FineXT 6003 Multi-chip, Multi-placement Die Bonder Up to 3 µm accuracy High volume manufacturing system |
products/micro-assembly/finext-5205.html | FineXT 5205 Automated Flexible Bonding Platform High accuracy R&D and Production |
products/micro-assembly/fineplacerr-femto-2.html | FINEPLACER® femto 2 Automated Prototype2Production Bonder 0.5 micron accuracy Production Platform, Maximum Yield |
products/micro-assembly/fineplacerr-sigma.html | FINEPLACER® sigma Semi-automated Sub-Micron Bonder 0.5 micron, 300 mm wafer Bonding forces up to 1000N |
products/micro-assembly/fineplacerr-lambda.html | FINEPLACER® lambda Flexible Sub-micron Die Bonder 0.5 micron accuracy Application versatility |
products/micro-assembly/fineplacerr-pico-ma.html | FINEPLACER® pico ma Multi-purpose Die Bonder 5 micron accuracy Application versatility |
products/micro-assembly/clever-dispense.html | Clever Dispense Volumetric dispensing with high quality results. |
products/micro-assembly/fineplacerr-pico-ma/fineplacerr-pico... | Customized Bonders Based on FINEPLACER® platforms, Finetech develops highly customized equipment solutions according to specific... |
products/advanced-rework.html | Advanced Rework |
products/advanced-rework/fineplacerr-coreplus.html | FINEPLACER® coreplus The perfect blend of performance and cost for Rework Proven technology where process reproducibility is cri... |
products/advanced-rework/fineplacerr-pico-rs.html | FINEPLACER® pico rs High Density Rework Station Rework in high density environments |
products/advanced-rework/hotbeam-underheater.html | Hotbeam Underheater The compact and flexible Hotbeam underheater is the ideal supplement to a FINEPLACER® rework station. |
products/advanced-rework/minioven.html | Minioven A compact and versatile IR reflow oven suitable for a wide range of SMD components |
products/advanced-rework/cleverdispense.html | CleverDispense Volumetric dispensing with high quality results. |
bonders/applications.html | Applications |
bonders/applications/focal-plane-arrays-ir-sensor-assembly.h... | Focal Plane Arrays / IR Sensor Assembly High pixel/bump counts and densities, small bump sizes and extremely narrow pitch make F... |
bonders/applications/laser-bar-bonding.html | Laser Bar Bonding Semiconductor lasers are versatile, light-emitting optical units which can be found in a variety of industrial... |
bonders/applications/laser-characterization.html | Laser Characterization Customized laser characterization and test systems with the open FINEPLACER® machine platform. |
bonders/applications/optoelectronic-flip-chip-assembly.html | Optoelectronic Flip Chip Assembly A growing requirement to include optical devices in microelectronic assemblies presents new ch... |
bonders/applications/rfid-assembly.html | RFID Assembly RFID (Radio Frequency Identification) tags are used as an alternative to bar codes for inventory control and theft... |
bonders/applications/thermosonic-flip-chip-bonding.html | Thermosonic Flip Chip Bonding The thermosonic bonding advantages and the disadvantages of lead-free solder are stimulating the g... |
bonders/applications/vcsel-photo-diode.html | VCSEL & Photo Diode The assembly and packaging of optoelectronic devices is... |
bonders/applications/chip-on-glass-cog.html | Chip-on-Glass (CoG) Chip-On-Glass is a flip chip technology for direct connection assembly of ICs on glass substrates by using a... |
nc/bonders/applications/optical-package-assembly.html | Optical Package Assembly Optical packages are assemblies comprising optical and electronic components. |
bonders/applications/micro-led-micro-optics.html | Micro LED / Micro Optics Miniaturized optical components are used areas such as medical technologies, consumer electronics, auto... |
bonders/applications/large-componentwafer-scale-assembly.htm... | Large Component/Wafer Scale Assembly Finetech offers specific equipment solutions for high-accuracy assembly processes of large ... |
bonders/technologies.html | Technologies |
bonders/technologies/transfer-of-viscous-media.html | Transfer of Viscous Media The reproducible transfer of glue or solder paste is a critical factor of success for many application... |
bonders/technologies/ausn-soldering.html | AuSn Soldering Gold/Tin (Au/Sn) make for hard solder alloys especially used to bond demanding microelectronic and optoelectronic... |
bonders/technologies/ultrasonic-thermosonic-bonding.html | Ultrasonic / Thermosonic Bonding Ultrasonic / thermosonic bonding is a connection process that does not need bonding wires and i... |
bonders/technologies/thermocompression.html | Thermocompression Thermocompression bonding is a connection process that does not need bonding wires. It is mainly used in case ... |
bonders/technologies/adhesive-technologies.html | Adhesive Technologies Adhesive materials can be applied between two join partners in various ways. |
bonders/technologies/sintering.html | Sintering Sintering technologies are predominantly used for high power electronics dependent on high thermal and electrical cond... |
bonders/technologies/diffusion-bonding.html | Diffusion Bonding FINEPLACER® systems support the flexible integration of various diffusion bonding technologies. |
bonders/technologies/bonding-technologies-for-3d-packaging.h... | Bonding Technologies for 3D Packaging An introduction to interconnect technologies for 3D packaging applications with high bump ... |
bonders/technologies/precision-vacuum-die-bonding.html | Precision Vacuum Die Bonding Bonding under vacuum offers many advantages and allows processes unattainable at atmospheric pressu... |
bonders/technologies/laser-assisted-die-bonding.html | Laser-assisted Die Bonding Direct laser soldering or indirect laser-assisted die bonding. |
bonders/products.html | Products |
bonders/products/finext-6003.html | FineXT 6003 Multi-chip, Multi-placement Die Bonder Up to 3 µm accuracy High volume manufacturing system |
bonders/products/finext-5205.html | FineXT 5205 Automated Flexible Bonding Platform High accuracy R&D and Production |
bonders/products/fineplacerr-femto-2.html | <img> |
bonders/products/fineplacerr-sigma.html | FINEPLACER® sigma Semi-automatic Sub Micron Bonder 0.5 micron, 300 mm wafer Bonding forces up to 1000N |
bonders/products/fineplacerr-lambda.html | <img> |
bonders/products/fineplacerr-pico-ma.html | FINEPLACER® pico ma Multi-purpose Die Bonder 5 micron accuracy Application versatility |
bonders/videos/vcsel-assembly-face-down.html | VCSEL Assembly (face-down) FINEPLACER® lambda |
bonders/videos/vcsel-pd-assembly-face-up.html | VCSEL & PD Assembly (face-up) FINEPLACER® lambda |
bonders/videos/automatic-die-bonding.html | Automatic Die Bonding FINEPLACER® femto 2 |
bonders/videos/3d-stacking.html | 3D-Stacking How to video: 3D-Stacking |
bonders/videos/flipping.html | Flipping How to video: Flipping |
bonders/videos/manual-control.html | Manual Control How to video: Manual Control |
bonders/videos/sensor-assembly.html | Sensor Assembly How to video: Sensor Assembly |
bonders/videos/chip-on-wafer-assembly.html | Chip on Wafer Assembly How to video: Chip on Wafer Assembly |
bonders/videos/ausn-laser-bar-bonding.html | AuSn Laser Bar Bonding How to video: AuSn Laser Bar Bonding |
bonders/videos/thermosonic-bonding.html | Thermosonic Bonding How to video: Au-Au Thermosonic Bonding |
bonders/videos/ultrasonic-bonding.html | Ultrasonic Bonding How to video: Ultrasonic Bonding |
bonders/videos/laser-bar-bonding.html | Laser Bar Bonding How to video: Laser Bar Bonding |
bonders/videos/rd-bonder.html | R&D Bonder FINEPLACER® lambda - R&D Bonder |
bonders/videos/sub-micron-die-bonder.html | Sub Micron Die Bonder FINEPLACER® sigma |
bonders/blog.html#c8889 | all blogs |
bonders/blog/22-is-rework-a-commodity.html | learn more |
bonders/blog/21-lidar-everywhere.html | #21 - LiDAR Everywhere! Is it me or is everyone in technology talking about LiDAR these days? So what is it and why is everyone ... |
bonders/blog/20-laser-assist-and-laser-bonding.html | #20 - Laser Assist and Laser Bonding Achieving a void-free eutectic Gold/Tin (e.g. Au80Sn20) bond for laser bar bonding is a pre... |
bonders/blog/19-bonding-materials-and-methods.html | #19 - Bonding Materials and Methods It’s always interesting to learn about the chemistries our customers will use in next genera... |
bonders/blog/18-moving-from-prototype-to-production.html | #18 - Moving from Prototype to Production It's great to see our customers move from prototype and development bonding to product... |
bonders/blog/17-a-toast-to-cool-customers.html | #17 - A Toast to Cool Customers! One of the best things about working at Finetech is we get to see some really incredible new te... |
bonders/blog/16-active-alignment-in-photonics.html | #16 - Active Alignment in Photonics One of the most intriguing applications with regard to optical device packaging and silicon ... |
bonders/blog/15-medical-imaging-sensor-packaging.html | #15 - Medical Imaging Sensor Packaging The wide range of imaging sensors used in medical applications requires diversity in asse... |
bonders/blog/14-another-year.html | #14 - Another Year! 2015 was a great year and we look forward to the bonding and advanced packaging challenges on 2016! |
bonders/blog/13-flex-circuit-bonding.html | #13 - Flex Circuit Bonding Increasingly, we are asked about die bonding to flexible printed circuits by medical companies or bio... |
bonders/blog/archive.html | Archive Find previous entries from Finetech's Bonding Blog. |
rework/applications.html | Applications |
rework/applications/rework-of-cpugpu-components.html | Rework of CPU/GPU Components Complex, integrated component designs make CPU/GPU units not your everyday rework challenge. |
rework/applications/rework-of-bga-csp.html | Rework of BGA / CSP BGA Rework has become synonymous for SMT Rework in general. Learn more... |
rework/applications/rework-of-shielded-smd.html | Rework of Shielded SMD As PCB real-estate continues to be in high demand, the RF shield design will remain a challenge to rework... |
rework/applications/rework-of-smd-connectors.html | Rework of SMD Connectors SMD connectors are becoming ever more important, but highly varied layouts and dense PCB population res... |
rework/applications/qfn-rework.html | QFN Rework Flat packages such as QFN provide many benefits but make much higher demands compared to the handling of standard SMD... |
rework/applications/small-passives-rework-008004-and-01005.h... | Small Passives Rework - 008004 and 01005 008004 and 01005 small passive components are becoming more and more important these da... |
rework/applications/rework-of-uled-components.html | Read more |
rework/applications/package-on-package-pop.html | Package on Package (PoP) Package on Package (PoP) is an IC-packaging technology with vertical combined logic and memory componen... |
rework/applications/underfill-rework.html | Underfill Rework Underfilled chips are used in consumer electronics, automotive industry or many miniaturized product. |
rework/applications/chip-on-flex-rework.html | Chip-on-Flex Rework Flexible substrates are used in 3D connection and mechatronic concepts for... |
rework/applications/flip-chip-rework.html | Flip Chip Rework Flip Chip rework is becoming more important in order to save costs by recycling valuable materials. |
rework/processes.html | Processes |
rework/processes/single-ball-reballing.html | Single Ball Reballing Finetech offers reliable reballing solutions for single ball replacement down to 200 µm dia. |
rework/processes/array-reballing.html | Array Reballing The accurate placement a new array of solder spheres is called array reballing. |
rework/processes/residual-solder-removal.html | Residual Solder Removal This section deals with the process related issue of eliminating residual solder once a component has be... |
rework/processes/apply-solder-paste.html | Apply Solder Paste Finetech offers various equipment solutions to integrate the suitable solder application method into the rewo... |
rework/products.html | Products |
rework/products/fineplacerr-coreplus.html | FINEPLACER® coreplus The perfect blend of performance and cost for Rework Proven technology where process reproducibility is cri... |
rework/products/fineplacerr-pico-rs.html | FINEPLACER® pico rs High Density Rework Station Rework in high density environments |
rework/products/hotbeam-underheater.html | Hotbeam Underheater The compact and flexible Hotbeam underheater is the ideal supplement to a FINEPLACER® rework station. |
rework/products/minioven.html | Minioven A compact and versatile IR reflow oven suitable for a wide range of SMD components |
rework/products/cleverdispense.html | CleverDispense Volumetric dispensing with high quality results. |
rework/videos/qfnmlf-rework.html | QFN/MLF Rework How to - application video |
rework/videos/mobile-phone-rework.html | Mobile Phone Rework How to - application video |
rework/videos/bga-rework.html | BGA Rework How to - application video |
rework/videos/cpugpu-rework.html | CPU/GPU Rework How to - application video |
rework/videos/01005-small-passives-rework.html | 01005 Small Passives Rework How to - application video |
rework/videos/bga-reballing.html | BGA Reballing How to - application video |
rework/videos/audio-chip-repair.html | Audio Chip Repair How to - application video |
markets/industries-served/medical.html | Medical For medical electronics R&D and manufacturing, the requirements are particularly high for quality, reliability, space an... |
markets/industries-served/rd-universities.html | R&D / Universities The common equipment needs of researchers are high accuracy, quick setup/changeover, minimal programming, as ... |
markets/industries-served/photonics-optoelectronics.html | Photonics / Optoelectronics Bonding and assembly of delicate photonic and optoelectronic devices require the highest placement a... |
markets/industries-served/automotive.html | Automotive The system electronics included in connected automobiles become progressively complex with higher functionality on ev... |
markets/industries-served/military-aerospace.html | Military / Aerospace Aerospace and military applications deal with high-reliability electronics and high performance components ... |
markets/industries-served/other-markets.html | Other Markets Finetech provides machine solutions for a wide range of industries. |
contacts/sales.html | Sales |
contacts/sales/sales-contact-search.html | Sales Contact Search Find the contact for your area. |
contacts/sales/international-locations.html | International Locations Finetech provides service worldwide. |
contacts/sales/us-locations.html | US Locations Visit us in one of our locations near you. |
service/contact.html | Contact us Get in contact with us. |
company/information.html | Information |
company/information/events.html | Events Read more about our worldwide trade show activities. |
company/information/press.html | Press Latest news about products and company activities. |
company/information/job-opening.html | Job Opening Join our Finetech USA team. |
company/information/about-us.html | About us Learn more about the company and it's history. |
company/information/imprint.html | Imprint |
service/sitemap.html | Sitemap |
service/login.html?redirect_url=home.html | Partner Login |
service/contact.html?tx_powermail_pi1%5BclearSession%5D=-1 | Get in Contact |
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